Experimental stress analysis equipment

Automated photoelastic stress analysis equipment

VisEng can offer the very latest modern photoelastic stress analysis equipment which, together with easy to apply photoelastic coating material, can provide real experimental stress data quickly and efficiently on a wide variety of materials or structures. Ideal for validation of FEA, or the determination of potential stress concentrations.

GFP1600 Automated Polariscope – see brochure (PDF)
The very latest miniature automated polariscope from Stress Photonics, capable of providing the operator with a real-time polarised view of the test sample and then capturing data for incremental static structural testing. This device is simply operated via a USB port of a laptop PC or even a Windows-based notebook or tablet. This makes the whole package affordable, extremely portable and very easy to use.
GFP2500 Automated Polariscope – see brochure (PDF)
Stress Photonics automated polariscope capable of taking dynamic stress results up to a speed of 20 frame per second. The instrument can also be operated wirelessly for remote structural testing and can be set up to measure long-term tests by storing stress images over a lengthy period of time.
Brush-on photoelastic coatings
For use on non-transparent materials for measuring surface stresses.

Thermoelastic stress analysis equipment

DeltaVision TSA
Latest thermoelastic stress analysis equipment and analysis software to allow dynamic measurements on components or structures.

Glass quality inspection equipment

(can also be used on clear plastics or acrylics)

Automated quality inspection equipment

EdgeMaster-2 – see brochure (PDF)
The new EdgeMaster-2 builds on the success of the old EM1, allowing easy edge stress measurement on both tempered and laminated glass. As with the EM1 it can work with the black print on the glass, but with more efficient LED lighting (which also makes it much lighter, hence easier to handle than the EM1) it can achieve results on tinted glass down to approximately 20% light transmission. New software makes it easier to use and each image is now self-calibrating ensuring greater accuracy of results.
Coupon specimen testing to determine through thickness stress profile
Online monitoring of toughening patterns

Manual inspection equipment

Photovoltaic/silicon chip or wafer quality inspection equipment

Near-infrared photoelasticity equipment

This equipment can be used to detect flaws and stresses in silicon chips, wafers and photovoltaic cells. It uses a near-IR light source and detector coupled with GFP technology to measure stresses within the silicon. It can be used to determine machining stresses or internal defects which could lead to premature failure.